Semiconductor Process.pptx |
목차 1. Wafer cleaning & Oxidation 2. Photolithography 3. Etching 4. Metal deposition 5. Silicidation 6. QnA 본문 Lithography Si Wafer coated with PR Spin coating PR is coated evenly by turning round rapidly. Exposure Align the Mask exactly and emit UV.(fixed 10sec) Observation See the completed sample through SEM Development Dip the sample in the alkaline solution. →(process parameter : 10sec 60sec 180sec) Due to differences in solubility of the exposed portion to be dissolved only. The process making patterning. |
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