[레포트] 리소그래피 실험 래포트 (영문).docx |
본문 Lab 1 Report Photolithography 1. Introduction Photolithography is the technique that is utilized to obtain patterns on the substrate by using the photoresist (PR), patterned mask, mask aligner, and etchant. Desired pattern can be attained by irradiating light with specific wavelength on the PR coated substrate through the mask surface of irradiated PR becomes reactive with PR etchant which can be lifted off by using appropriate etchant. This is not the end of photolithograpy. The photolithography process ends after patterned substrate is etched with various etching techniques. In order to get wanted pattern on the substrate using photolithography, there are few variants including masks and photoresist that can control the outcome along the process. There are two different types of PRs, positive PR and negative PR, which lead to different results. The positive PR becomes reactive to the PR etchant when the light is irradiated where negative PR behaves the opposite. In addition the mask can be categorized into two types, clear field and dark field. For the clear field mask, only the pattern is coated with chrome so that light cannot penetrate through the pattern. In contrast, dark field mask is entirely coated with chrome except the pattern. Figure 1 describes how different types of PR and masks produce the different results. Clear field mask Dark field mask Positive PR Negative PR Positive PR Negative PR Figure 1.Schematics of phtolithography process result with various masks and photoresists 2. Experiment Substrate (Wafer) cleaning 하고 싶은 말 좀 더 업그레이드하여 자료를 보완하여, 과제물을 꼼꼼하게 정성을 들어 작성했습니다. 위 자료 요약정리 잘되어 있으니 잘 참고하시어 학업에 나날이 발전이 있기를 기원합니다 ^^ 구입자 분의 앞날에 항상 무궁한 발전과 행복과 행운이 깃들기를 홧팅 키워드 실험, 래포트, 레포트, 리소그래피, 영문 |
2019년 1월 24일 목요일
레포트 리소그래피 실험 래포트 (영문)
레포트 리소그래피 실험 래포트 (영문)
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