2019년 1월 24일 목요일

레포트 리소그래피 실험 래포트 (영문)

레포트 리소그래피 실험 래포트 (영문)
[레포트] 리소그래피 실험 래포트 (영문).docx


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Lab 1 Report
Photolithography
1. Introduction
Photolithography is the technique that is utilized to obtain patterns on the substrate by using the photoresist (PR), patterned mask, mask aligner, and etchant. Desired pattern can be attained by irradiating light with specific wavelength on the PR coated substrate through the mask surface of irradiated PR becomes reactive with PR etchant which can be lifted off by using appropriate etchant. This is not the end of photolithograpy. The photolithography process ends after patterned substrate is etched with various etching techniques. In order to get wanted pattern on the substrate using photolithography, there are few variants including masks and photoresist that can control the outcome along the process. There are two different types of PRs, positive PR and negative PR, which lead to different results. The positive PR becomes reactive to the PR etchant when the light is irradiated where negative PR behaves the opposite. In addition the mask can be categorized into two types, clear field and dark field. For the clear field mask, only the pattern is coated with chrome so that light cannot penetrate through the pattern. In contrast, dark field mask is entirely coated with chrome except the pattern. Figure 1 describes how different types of PR and masks produce the different results.
Clear field mask
Dark field mask
Positive PR
Negative PR
Positive PR
Negative PR
Figure 1.Schematics of phtolithography process result with various masks and photoresists
2. Experiment
Substrate (Wafer) cleaning

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키워드
실험, 래포트, 레포트, 리소그래피, 영문

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